Copper strip with high electrical conductivity ís used in the production of leadframes, on which chips are mounted. These chips have extremely small structures. During wire bonding, connections between the leads and the chip are enabled via gold wire bonding. These wires are usually less than 50 microns in diameter. Therefore, Wieland strip supplied for this purpose has an absolutely smooth and flawless surface with extremely low surface roughness. High temperature resistance (softening resistance) of the strip is required for the encapsulation process of the chip, via plastic moulding.
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http://www.wieland.de/internet/content/wieland/en/branchen/startseite_branchenportal_elektronik/produkte_2/fuer_datentechnik/halbleiterbauelemente_1/leadframes/leadframes.jsp
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- Semiconductor components
- Leadframes
Leadframes
| Mainly the following materials: |
| M15 (PDF, 52 KB) |
| K55 (PDF, 53 KB) |
| K65 (PDF, 0.2 MB) |
| K80 (PDF, 51 KB) |
| in thicknesses of 0.127 mm, 0.252 mm and 0.254 mm are usually used for these purposes. |
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