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Scientific Publications - Base materials and their properties

* Available in German only

1.45

Properties of High Performance Alloys for Electromechanical Connectors

H.-A. Kuhn, I. Altenberger, A. Käufler, H. Hölzl, M. Fünfer
Copper Alloys - Early Applications and Current Performance - Enhancing Processes, ISBN 978-953-51-0160-4, (editor Luca Collini), InTech, 2012, p 52 - 68
Abstract

1.44 *

Possibilities of alloy development for connectors

Dr. Isabell Buresch, Dr. H.-A. Kuhn
Third Symposium Connectors, Lemgo, 2 - 3 March 2011
Abstract

1.43 *

Formability of copper based connector materials - praxis and simulation

D. Ringhand, Academy Heilbronn; H.-A. Kuhn, A. Käufler, M. Wojcicki
20. Symposium "Albert-Keil-Kontaktseminar", Karlsruhe 7 - 9 October 2009, VDE-Technical Report 65
Abstract

1.42

Contact Resistance, Formability and Strength

Optimizing all Parameters in Fine Grain Bronzes for Connector Applications
I. Buresch, F. Bubeck
24th International Conference on Electrical Contacts ICEC2008, June 9-12 in Sain Malo, France
Abstract

1.41

Copper Based Solid Solution Alloys for Connectors

Optimization of Properties
F. Bubeck, A. Kuhn, I. Buresch
14th "Sächsische Fachtagung für Umformtechnik SFU", TU Freiberg 4 - 12 December 2007
Abstract

1.40 *

Material trends for connector applications

high strength and good bending properties
I. Buresch
ElektronikPraxis special edition 11/2007, Elektromechanik II, from page 28
Abstract

1.39 *

Stress relaxation of copper alloys and their measuring methods

S. Groß, Wieland-Werke, T. Helmenkamp, KME, M. Köhler, Sundwiger, V. Tietz, Kemper
19th "AKK Kontaktverhalten und Schalten", Karlsruhe 26 - 28 September 2007
Abstract

1.38 *

Old wine in new bottles

Traditional connector materials - high strength and good formability
I. Buresch, A. Möck, F. Bubeck
19th "AKK Kontaktverhalten und Schalten", Karlsruhe 26 - 28 September 2007
Abstract

1.37

A new high performance copper based alloy for electro-mechanical connectors

H.-A. Kuhn, A. Käufler, D. Ringhand, S. Theobald
Materialwissenschaft und Werkstofftechnik 2007, 38, No. 8
Abstract

1.36 *

Changes in requirements for connectors and consequences for base materials and coatings

I. Buresch, S. Theobald, F. Bubeck
1st “Symposium Connectors”, Lemgo, March 8, 2007
Abstract

1.35

A Copper Chromium Alloy with Flexible Properties

H.-A. Kuhn, D. E. Tyler, P. W. Robinson
World of Metallurgy - ERZMETALL 60 (2009) No. 1, pages 69 - 76
Abstract

1.34 *

Technical properties and importance of formability of copper alloys for automotive connectors

S. Theobald, I. Buresch, U. Hofmann
Metall 11/2006, pages 734 - 737
Abstract

1.33

Bendability of Strip Material

A Key Issue for Connector Applications
I. Buresch, U. Hofmann, S. Theobald
Copper 06 SF2M International Conference Compiegne, September 12-15, 2006
Abstract

1.32 *

High-performance copper alloys

Which combinations of properties for connector applications can be achieved today?
Dr. Isabell Buresch
18th "AKK Kontaktverhalten und Schalten", Karlsruhe 5 - 7 October 2005
Abstract

1.31

The Metallography of Copper and Copper Alloys

U. Hofmann, A. Bögel, H. Hölzl, H.-A. Kuhn
Prakt. Metallography 42 (2005) 7
Abstract

1.30

Copper alloys for connectors – new developments and current trends

Buresch, I.
VDE-Fachbericht Kontaktverhalten und Schalten Nr. 59, 17.
Kontaktseminar Karlsruhe, 10/03, pages 101 – 105
Abstract

1.29

A New Third Generation High Performance Copper Alloy for Electronic Interconnect Applications

Abid A. Khan, Olin Brass, Peter Robinson, Olin MRL, Dr. Dieter Stock & Michael Keppeler, Wieland-Werke
36th Annual IICIT Connector & Interconnection Symposium, September 18-19, 2003
Abstract

1.28 *

New copper alloys for electrical and electronic applications

Keppeler, M., Theobald, S., Kuhn, H.-A., Bögel, A.
Metall 7-8/2003, Pages 460 - 465
Abstract

1.27 *

Copper based materials for electrical contacts

G. Müller, A. Bögel
TAE-Seminar 2003 „Materials for electrical contacts and their applications", Ostfildern-Nellingen, 02/2003, presentation No. 3 Abstract

1.26

A new Copper-Alloy for Connector Applications Combining High Electrical Conductivity and High Strength

D. Stock, J. Seeger
Presentation ICEC - Zürich, 09/02
Abstract

1.25

K88/C18080 - A customer-designed alloy for connector application

Seeger, J., Kuhn, H.-A., Bögel, A., Buresch, I.
Metall 5/2002, Pages 289 - 292
Abstract

1.24 *

Bespoke service for customers

A. Bögel, U. Hofmann
QZ – Qualität und Zuverlässigkeit (quality and reliability), Jahrgang 46, 2001, pages 440 – 445
Abstract

1.23 *

Orientation dependencies of Young 's modulus E and shear modulus G of tempered Cu-strips for spring elements

A. Kuhn, R. Nothelfer-Richter - IdM , F. Futterknecht - IdM
Metall Jahrgang 54/2000, pages 575 – 580
Abstract

1.22

Copper in Automobiles of the Future

D. Stock, A. Bögel
Metall 1-2/2000, Pages 51 - 54
Abstract

1.21

Stress relaxation in copper and copper alloys - Shortening experiments

A. Bögel
Metall 4/98, Page 208 ff
Abstract

1.20 *

Nickel-free Manganese Bronze for Fashion Accessories

A. Bögel
Metall 51, Nr. 11/97, Pages 634 - 637
Abstract

1.19 *

Cupro-nickel-silicon-graphite alloy, spray compacted method

K.H. Füller, D. Stock
Metall 49, Nr. 4/95, Pages 274 - 277
Abstract

1.18

Spray forming of copper alloys on an industrial scale

D. Stock
Metall 49, Nr. 11/95, Pages 737 - 739
Abstract

1.17

Reliability of Materials for Connectors

A. Bögel, I. Buresch, G. Müller
VDE-Fachbericht Kontaktverhalten und Schalten, 13. Kontaktseminar 10/95, Pages 43 - 52
Abstract

1.16

Stress relaxation in copper alloys for plug connectors and spring elements

A. Bögel
Metall 48, Nr. 11/94, Pages 872 - 876
Abstract

1.15 *

Latest Copper Alloys for Connectors and Semiconductors

A. Bögel
Blech Rohre Profile 39 (1992) 12
Abstract

1.14 *

Stress relaxation of copper alloys

S. Gross
Metall 45, Nr. 11/91, Page 1108
Abstract

1.13 *

The Secant Module concept

A new way of calculation spring elements
from copper alloys H. Galla, M. Greiner, S. Gross Metall 45, Nr. 11/91, Page 1108
Abstract

1.12

Measuring instrument for recording internal stress in thin slit strip

J. Cüppers
Metall 44, Nr. 7/90, Page 662
Abstract

1.11 *

Copper Alloy Strip for Flat Springs

H. Scholz
Draht 39 (1988), Seite 10
Abstract

1.10 *

Evaluation of Copper Base Alloys with Regard to their Relaxation Performance

J. Maier, H. Langer
2. DKI-Symposium Kupferwerkstoffe, Berlin (1988)
Abstract

1.09 *

Materials and Semis for the Microelectronic and Connector Industries

F. Puckert
F&M Feinwerktechnik & Messtechnik 94 (1986), Heft 2, Pages 109 - 112
Abstract

1.08 *

Materials for Semiconductors

F. J. Puckert, W. Dürrschnabel
productronic (1985), Teil1: Heft 5, Seiten 54 - 56; Teil 2: Heft 6, Pages 65 - 67
Abstract

1.07 *

Tension Relaxation of Copper Base Alloys

H. Langer, W. Dürrschnabel
Diskussionsunterlagen zur Vortrags- und Diskussionstagung "Werkstoffprüfung 1984", Bad Nauheim, DVM, Berlin (1984)
Abstract

1.06 *

Relaxation of Copper Alloys, Influences of Materials and Physical Properties

H. Langer
Berichtsband Vortragsveranstaltung "Kupferwerkstoffe für die Schwachstromtechnik - Wieland-Werke AG (1984), pages 49 - 69 Abstract

1.05 *

Bendability of Copper Materials for Spring Components

D. Siemers, H. Stüer und W. Dürrschnabel
Feinwerktechnik + Meßtechnik 89 (1981) Heft 1, pages 24 - 27
Abstract

1.04 *

Anisotropy in copper - alloy spring strip

J. Hirsch und W. Dürrschnabel
Z. Werkstofftechnik 12 (1981), Seiten 256 - 262
Abstract

1.03 *

Wieland-L49 and Wieland-S23, Two Innovative Materials for the Electrical Industry

J. Rabenschlag
Berichtsband Vortragsveranstaltung "Kupferwerkstoffe in der Schwachstromtechnik" - Wieland-Werke AG (1975), pages 53 - 80 Abstract

1.02 *

Properties and application of recently developed naturally hard copper alloys for spring components

J. Rabenschlag
Metall 29, No. 11/75, pages 1133 - 1138
Abstract

1.01 *

Directional Dependency of Copper Alloy Strip Properties

their Advantages and Disadvantages
W. Dürrschnabel
Sonderdruck aus Bänder Bleche Rohre 14 (1973) Nr. 5, pages 206 - 212
Abstract

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Officials (Prompt) of	05/22/2012
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Scientific Publications - Base materials and their properties

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